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Inovação de processo na adesivagem de placas eletrônicas para notebook: o caso de uma empresa de componentes no Polo Industrial de Manaus
(2025-07-09) Nascimento, Eraldo Pacaio do; Cordeiro, Celso Souza; http://lattes.cnpq.br/4969144304480235; Ribeiro, Ewerton Andrey Godinho; http://lattes.cnpq.br/0187470129136467; Lima, Jonatas Micael Vieira de; http://lattes.cnpq.br/4866950717399057
Organizations are always in constant technological advances, before that it was observed in the process of a production line in a company of electronic components in the industrial pole of Manaus that produces notebook, it was verified the possibility of making a innovation in the adhesive process on electronic boards. However, during these analyzes and observations, a great deal of adhesive wasted in the tubes and several reworks were found. The production operator was unaware of the existing amount of adhesive to be applied on the plate, and did not know exactly when to change that tube. Through this problem, the possibility of calculating the volume of adhesive in the tube was identified, and the UV adhesive sensor was created, as a device for monitoring the internal piston. In their specificity, the objectives aim to: reduce the waste of adhesive in the tubes used by production operators, eliminate rework on notebook boards, aiming at increasing the company's productivity and profitability. This study is justified by the need to solve a real problem in the productive process of electronic board adhesive, aiming at improving efficiency and effectiveness in production engineering. With the implementation of this innovation in the production process, a real gain in productivity, minimization of operating costs and improvement of quality in the adhesiveness of electronic boards were achieved.