Melhoria da dissipação térmica em placas de processamento gráfico através da aplicação dos conceitos da transmissão de calor por condução

Abstract

The present work aimed to verify the effects of conduction heat transfer concepts in thermal dissipation projects of GPU memory chips operation stability. Conduction heat transfer concepts will be presented, describing the importance of thermal interface materials, highlighting the impact of duty cycle in the design, pointing out the effects of working temperature in electronic equipment evaluating how to improve its heat dissipation and testing a way to increase its work stability. Bibliographic research was used, in addition to the case study developed from an experiment with boards from a processing complex. Measurements were performed through the processing software itself, obtaining the simple average and presenting the percentage gains. The change allowed for an average reduction of 10% in the working temperature, 19% in the use of fans and a slight reduction of 1% in the energy consumption of the equipment in operation. Finally, the work demonstrated the efficiency of the observed solution, bringing to light relevant knowledge for the decision-making of the population in question about the decision to apply the improvement in their equipment.